Overclocked Performance
RGB Lighting Controls
Optimized with XMP 2.0
Sleek Heat Spreader
Capacity
16GB Kit (8GB x 2), 32GB Kit(16GB x 2)
Memory Type
DDR4
Interface
288 Pin
Speed
3200Mbps
Standard
JEDEC / XMP 2.0
CAS Latency
CL19 / CL16-18-18-38
Voltage
1.2V / 1.35V
Operating Temperature
-20° C to 85°C (Surface)
Storage Temperature
-55°C to 100°C
Module Size
137.8 mm x 45.6 mm x 6.2 mm (with heat spreader)
Application
Gaming / Content Creating
Lexar products are tested in order to meet the stated specifications as advertised.
In case Lexar products are used in a system which may not operate in accordance with specifications as advertised by Lexar, or used together with other kits or memory modules from other manufacturers, Lexar will not guarantee that products meet the above specifications. Furthermore, Lexar will not guarantee that products meet the above specifications if a single module is paired with all other manufacturers’ DRAM module to operate as dual kit.
Product appearance, performance, software offerings, and packaging may vary depending on ship date and available inventory.
Region | Capacity | Part# |
---|---|---|
Global | 32GB Kit (16GB x 2) | LD4BU016G-R3200GDLH |
Global | 16GB Kit (8GB x 2) | LD4BU008G-R3200GDLH |
Global | 16GB (16GB x 1) | LD4BU016G-R3200GSLH |
Global | 8GB (8GB x 1) | LD4BU008G-R3200GSLH |
Region | Capacity | Part# |
---|---|---|
North America | 32GB Kit (16GB x 2) | LD4BU016G-R3200UDLH |
North America | 16GB Kit (8GB x 2) | LD4BU008G-R3200UDLH |
North America | 16GB (16GB x 1) | LD4BU016G-R3200USLH |
North America | 8GB (8GB x 1) | LD4BU008G-R3200USLH |
Region | Capacity | Part# |
---|---|---|
China | 32GB Kit (16GB x 2) | LD4BU016G-R3200CDLH |
China | 16GB Kit (8GB x 2) | LD4BU008G-R3200CDLH |
China | 16GB (16GB x 1) | LD4BU016G-R3200CSLH |
China | 8GB (8GB x 1) | LD4BU008G-R3200CSLH |